eMMC Adventures, Episode 4: Recovering data from physically damaged BGA eMMC Flash storage chips

As seen on Hackaday!

The ball grid array (BGA) chip package has been instrumental in getting modern electronics to fit in smaller and smaller spaces, as it uses tiny balls of solder on the bottom of the package to make electrical connections, instead of copper leads on the edge of the chip package. This allows for hundreds of connections to be made in a small amount of PCB area, but their size also makes them very vulnerable to damage as well.

One common way for BGA chips to become damaged is called “pad cratering“, where the copper pad on the package’s substrate (basically a wafer-thin circuit board) separates and leaves behind a crater.

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