The ball grid array (BGA) chip package has been instrumental in getting modern electronics to fit in smaller and smaller spaces, as it uses tiny balls of solder on the bottom of the package to make electrical connections, instead of copper leads on the edge of the chip package. This allows for hundreds of connections to be made in a small amount of PCB area, but their size also makes them very vulnerable to damage as well.
eMMC with severe pad cratering on critical data/control lines
One common way for BGA chips to become damaged is called “pad cratering“, where the copper pad on the package’s substrate (basically a wafer-thin circuit board) separates and leaves behind a crater.
Purchased a 1-year subscription to WordPress Personal on January 4, 2019
After staying on WordPress’ Free plan for almost 7 years, I’ve finally purchased a WordPress Personal subscription plan. Although it’s a bit more expensive than a free plan (duh), but we’ll see if the ad revenue that WordAds generates will be enough to cover the costs.
I wonder whether using the Free plan is a factor in how WordAds determines its payout rate. Let’s find out when I release my next update on WordAds revenue…