The ball grid array (BGA) chip package has been instrumental in getting modern electronics to fit in smaller and smaller spaces, as it uses tiny balls of solder on the bottom of the package to make electrical connections, instead of copper leads on the edge of the chip package. This allows for hundreds of connections to be made in a small amount of PCB area, but their size also makes them very vulnerable to damage as well.
eMMC with severe pad cratering on critical data/control lines
One common way for BGA chips to become damaged is called “pad cratering“, where the copper pad on the package’s substrate (basically a wafer-thin circuit board) separates and leaves behind a crater.
While on my quest for more eMMC-based storage devices, I stumbled upon a few devices that piqued my interest: eMMC-based SATA SSDs! I found two models of particular interest: Dell had M.2 modules with a 2.5″ adapter, and HP had custom boards intended for use in cheap laptops (for example, the HP 14-an012nr). Although the former was easier for me to use (but not acquire), I will be focusing on the latter in this blog post. Continue reading →